Surface Mount Device Package Types

A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case.

Surface mount device package types.

There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below. Sot 223 small outline transistor. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. The small outline integrated circuit soic plastic package is shown above.

A very large number of different types of package exist. Ceramic flat pack clga. A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. Ceramic land grid array see lga cpga.

Chip array small scale ball grid array cbga. Bumpered quad flat pack cabga ssbga. Ceramic pin grid array cpga graphic cqfp. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm.

Micro surface mount device extended technology. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame. Surface mount device package types soic package. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process.

Bump chip carrier bga. Surface mount device package types.